Historical valuation data is not available at this time.
Tianshui Huatian Technology Co., Ltd. is a China-based company primarily engaged in the packaging and testing of integrated circuits (IC). It operates in the semiconductor industry, providing services such as lead frame packaging, wafer bumping, and testing for a range of semiconductor products. The company has established itself as a significant domestic player in the IC packaging and testing sector, leveraging China's growing semiconductor demand and government support for the industry. Its competitive advantages include cost efficiency, established manufacturing capabilities, and a focus on mid-to-low-end packaging solutions that cater to both local and international markets.
The company invests in R&D to advance its packaging technologies, though specific patents or technological leadership details are not publicly highlighted in English-language sources.
Tianshui Huatian Technology presents exposure to China's semiconductor packaging and testing sector, supported by domestic demand and policy tailwinds. However, it operates in a competitive and cyclical industry with risks related to global trade dynamics, technological obsolescence, and capital intensity. Investment suitability depends on risk appetite and outlook for China's semiconductor industry growth.