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Tianshui Huatian Technology operates as a specialized semiconductor integrated circuit (IC) packaging and testing service provider, forming a critical link in the global electronics supply chain. The company's core revenue model is built on providing outsourced semiconductor assembly and test (OSAT) services to fabless semiconductor companies and integrated device manufacturers. Its service portfolio encompasses a range of packaging solutions, including lead frame packaging, alongside comprehensive testing services such as wafer probing, test development, and design simulation for analog, mixed-signal, and RF circuits. Operating within the highly competitive and capital-intensive technology sector, Huatian Technology serves a diverse international client base across key markets including China, Taiwan, South Korea, and the United States. Its market position is that of a significant domestic player in China's strategic push for semiconductor self-sufficiency, competing with larger global OSAT firms. The company's operations are essential for transforming fabricated wafers into finished, tested chips ready for integration into end-use electronic products, positioning it as a vital enabler for the broader technology and consumer electronics industries.
For the fiscal year, the company reported revenue of CNY 14.46 billion. Net income stood at CNY 616 million, resulting in a net profit margin of approximately 4.3%. The company demonstrated solid cash generation from operations, with operating cash flow reaching CNY 3.10 billion. This operational efficiency is notable within the capital-intensive semiconductor testing and packaging industry, where managing costs is critical to maintaining profitability.
Huatian Technology's diluted earnings per share were CNY 0.19 for the period. The company's capital expenditure of CNY -5.00 billion reflects significant ongoing investment in advanced packaging and testing equipment, which is essential for maintaining technological competitiveness. This high level of investment indicates a focus on expanding capacity and capabilities to meet evolving industry demands, though it places substantial demands on capital allocation.
The company maintains a cash and equivalents position of CNY 5.15 billion against total debt of CNY 9.12 billion. This debt level, while substantial, is characteristic of the capital-intensive nature of the semiconductor industry. The balance sheet reflects the financing required to support the company's significant capital expenditure program and its position within a sector that demands continuous technological upgrades and capacity expansion.
Huatian Technology has implemented a shareholder return policy, evidenced by a dividend per share of CNY 0.058. The company's growth trajectory is tied to the cyclical semiconductor industry and China's strategic investments in domestic semiconductor capabilities. The substantial capital expenditures suggest a focus on long-term capacity growth and technological advancement rather than short-term earnings maximization.
With a market capitalization of approximately CNY 35.75 billion, the company's valuation reflects its role in China's semiconductor ecosystem. A beta of 0.512 suggests the stock has exhibited lower volatility than the broader market, which may be attributed to its position in a strategically important industry. The valuation incorporates expectations for the company's participation in the long-term growth of the semiconductor sector, particularly within China.
The company's strategic advantage lies in its established position within China's critical semiconductor supply chain, benefiting from national policies aimed at increasing self-sufficiency. Its geographic presence in key markets provides diversification. The outlook is intrinsically linked to global semiconductor demand cycles and the success of China's broader technology independence initiatives, which drive investment in domestic packaging and testing capabilities.
Company Financial ReportsShenzhen Stock Exchange
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