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US · ASX · SEMICONDUCTORS

ASE Technology Holding Co., Ltd.

$35.55as of 2026-11-13 · Mkt cap 80.87B

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P/S
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Price history

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Technology · Semiconductors Kaohsiung, KH 811 aseglobal.com

How the business is doing

Fiscal 2011–2025, USD

Revenue
$648.9B+7.4% 5y CAGRd
20112025
Net income
$40.9B+9.2% 5y CAGRd
20112025
Free cash flow
-$-20.01B
20112025
Total equity
$373.4B+10% 5y CAGRd
20112025

Is it expensive?

Each multiple against its own 15-year range, or against peers where no history is available

P/E
Pro
with Pro
P/B
Pro
with Pro
P/S
Pro
with Pro
EV/EBITDA
Pro
with Pro
P/EG
Pro
with Pro
P/TBV
Pro
with Pro

Peers

Same-industry companies, ranked by market cap

Peer comparison

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Financials

Statements by fiscal year

USD millions

Line items

    USD millions

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      USD millions

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        About ASE Technology Holding Co., Ltd.

        Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.

        CEO
        Jason Chang
        Employees
        96.44K
        Beta
        1.46

        Disclaimer: Information on this page is provided for educational purposes only and does not constitute investment advice. Figures marked d are derived from the figures shown — for example upside = IC ÷ price − 1, CAGR over the last five fiscal years, and range bounds are 15-year or peer minimum and maximum.